Infinites technology advantages, storage industry advanced packaging technology, a variety of packaging
technology, advanced packaging process, package design simulation technology, chip testing technology,
DRAM testing, FLASH testing, test research and development capabilities, rich product development ex-
perience, customized services and new product research and development.
Infinites intelligent manufacturing base contains advanced chip packaging test production line, can provide
WAFER packaging, testing, R & D design, production one-stop service, packaging form SiP,LGA,BGA,QFN
and other high-end advanced technology, to provide DRAM,Flash,MEMS components, gyroscope, RF power
amplification and other packaging services.
Build a high-end R & D laboratory, equipped with ultrasonic scanning SAT, hot and cold shock chamber,
constant temperature and humidity test chamber, distortion test, high frequency vibration test and other high-
end equipment to simulate the stability, durability and wide temperature applicability of products in extreme
environments, providing strong support for the development of innovative storage products and quality yield.
Module manufacturing line, to achieve a high degree of automation and manufacturing process traceability,
can produce DRAM modules and SSD modules and other storage products
The 16-Layer Stack Die-FOW/FOD process uses a turn every 4 layers, so the 5th, 9th, and 13th Layers must
be covered with the gold wire using the FOW process to avoid pressing the gold wire of the previous layer
during the turn.
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