Product Details
Place of Origin: China
Brand Name: Infinites
Payment & Shipping Terms
Price: Negotiable
Delivery Time: 5-7days
Supply Ability: 12000000
Model NO.: |
DDR5N |
Material: |
Fiberglass Epoxy Resin + Polyimide Resin |
Application: |
Automotive Connector |
Flame Retardant Properties: |
V0 |
Mechanical Rigid: |
Rigid |
Processing Technology: |
Electrolytic Foil |
Base Material: |
Copper |
Insulation Materials: |
Organic Resin |
Brand: |
Infinites |
Usage: |
Rearview Mirror |
Usage1: |
Aerospace PCB |
Usage2: |
Large Server PCB |
Usage3: |
Intelligent Medical PCB |
Usage4: |
Industrial Internet PCB |
Transport Package: |
Sealed In Tinfoil |
Specification: |
As Requested |
Trademark: |
Infinites Or OEM |
Origin: |
China |
HS Code: |
8479909090 |
Supply Ability: |
500000PCS/Year |
Customization: |
Available |
Type: |
Android Mobile Phone Motherboard 4G |
Dielectric: |
CEM-4 |
Model NO.: |
DDR5N |
Material: |
Fiberglass Epoxy Resin + Polyimide Resin |
Application: |
Automotive Connector |
Flame Retardant Properties: |
V0 |
Mechanical Rigid: |
Rigid |
Processing Technology: |
Electrolytic Foil |
Base Material: |
Copper |
Insulation Materials: |
Organic Resin |
Brand: |
Infinites |
Usage: |
Rearview Mirror |
Usage1: |
Aerospace PCB |
Usage2: |
Large Server PCB |
Usage3: |
Intelligent Medical PCB |
Usage4: |
Industrial Internet PCB |
Transport Package: |
Sealed In Tinfoil |
Specification: |
As Requested |
Trademark: |
Infinites Or OEM |
Origin: |
China |
HS Code: |
8479909090 |
Supply Ability: |
500000PCS/Year |
Customization: |
Available |
Type: |
Android Mobile Phone Motherboard 4G |
Dielectric: |
CEM-4 |
Single Sided
Plated Through Hole
Multi-Layer (Up to 40 Layers) including buried and blind Via's
Multi-Layer with bonded heat sinks
Flexible PCB
Flex-Rigid PCB
High Temperature (Polyimide)
Microwave (PTFE)
Copper Invar Construction
Special Gold for 'Chip on Board'
Controlled Impedance
Aluminium Clad Technologies
Fast/Quick Turn PCB Prototyping
Good quality
DFM simulation
Video
Video
