Product Details
Place of Origin: China
Brand Name: HUALIAN
Certification: RoHS, ISO
Model Number: HUALIAN-PCBA185
Document: Introduction of Hualian(1)....).pptx
Payment & Shipping Terms
Minimum Order Quantity: 1pcs
Price: 0.04usd-1usd/pcs
Packaging Details: ESD Bag+Bubble Wrapped +Carton
Delivery Time: 5-7days
Payment Terms: T/T, L/C
Supply Ability: 50000/Month
Layers: |
Multilayer |
Base Material: |
Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free |
Customized: |
Customized |
Condition: |
New |
Origin: |
China |
Package Size: |
50.00cm * 30.00cm * 20.00cm |
Package Gross Weight: |
10.000kg |
Lead Time: |
3 Days To Be Negotiated ( > 50 Pieces) |
Layers: |
Multilayer |
Base Material: |
Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free |
Customized: |
Customized |
Condition: |
New |
Origin: |
China |
Package Size: |
50.00cm * 30.00cm * 20.00cm |
Package Gross Weight: |
10.000kg |
Lead Time: |
3 Days To Be Negotiated ( > 50 Pieces) |
| Model NO. | hualian-PCBA185 | Condition | New |
| Certificate | ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS |
PCB Material
|
Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free |
| PCB Shape | Rectangular, Round, Slots, Cutouts, Complex | Solder Mask | Green/Black/White/Red/Blue/Yellow/Purple..etc |
| Board Thickness | 0.2mm-8mm | Copper Thickness | 18um-3500um(0.5- 100oz) |
| Service | PCB/Componentssourcing/Assembly/Test/Package | PCBA QA | Full Test Include Aoi, in-Circuit Test (Ict) |
| Layer | 1-36 Layers | Max. PCB Size | 1900mm*600mm |
| Profiling Punching | Routing, V-Cut, Beveling | Surface Finishing | HASL/HASL Lead Free, Chemical Tin, Chemical Gold |
| PCB Type | Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible | Test | X-ray, Aoi, in-Circuit Test (Ict), Functional Test |
| PCBA Packaging | ESD Packaging, Shockproof Packaging, Anti-Drop | Transport Package | ESD Bag+Bubble Wrapped +Carton |
| Specification | Customized PCBA | Trademark | hualian |
| Origin | Made in China | ||
| Production Capacity | 50000/Month |
| 1 to 36 layers rigid pcb and 2 to 14 layers flexible and rigid flexible pcb |
| Blind/buried holes with sequential lamination |
| HDI builds microthrough-hole technology with solid copper filling through holes |
| · On-off and non-on-off filling in gasket technology |
| Heavy copper weighs up to 12 ounces. Plate thickness up to 6.5mm. Board size up to 1010X610mm. |
| Special materials and mixed structures |
Specification
| Item | Specification | |
| 1 | Numbr of Layer | 1-18Layers |
| 2 | Material | FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate |
| 3 | Surface Finish | HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek) |
| 4 | Finish Board Thickness | 0.2mm-6.00 mm(8mil-126mil) |
| 5 | Copper Thickness | 1/2 oz min;12 oz max |
| 6 | Solder Mask | Green/Black/White/Red/Blue/Yellow |
| 7 | Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| 8 | Min.Hole Diameter for CNC Driling | 0.1mm(4mil) |
| 9 | Min.Hole Diameter for punching | 0.9mm(35mil) |
| 10 | Biggest panel size | 610mm*508mm |
| 11 | Hole Positon | +/-0.075mm(3mil) CNC Driling |
| 12 | Conductor Width(W) |
0.05mm(2mil)or; +/-20% of original artwork |
| 13 | Hole Diameter(H) |
PTH L:+/-0.075mm(3mil); Non-PTH L:+/-0.05mm(2mil) |
| 14 | Outline Tolerance |
0.125mm(5mil) CNC Routing; +/-0.15mm(6mil) by Punching |
| 15 | Warp & Twist | 0.70% |
| 16 | Insulation Resistance | 10Kohm-20Mohm |
| 17 | Conductivity | <50ohm |
| 18 | Test Voltage | 10-300V |
| 19 | Panel Size | 110×100mm(min);660×600mm(max) |
| 20 | Layer-layer misregistration |
4 layers:0.15mm(6mil)max; 6 layers:0.25mm(10mil)max |
| 21 | Min.spacing between hole edge to circuity pqttern of an inner layer | 0.25mm(10mil) |
| 22 | Min.spacing between board oulineto circuitry pattern of an inner layer | 0.25mm(10mil) |
| 23 | Board thickness tolerance |
4 layers:+/-0.13mm(5mil); 6 layers:+/-0.15mm(6mil) |
| 24 | Impedance Control | +/-10% |
| 25 | Different Impendance | +-/10% |
| * Gerber files of the bare PCB |
| * Bill of materials include: Manufacturer's part number, type of part, type of packaging,component locations listed by reference designators and quantity |
| * Dimensional specifications for non-standard components |
| * Assembly drawing, including any change notice |
| * Pick and Place file |
| * Final test procedures (if customer need us test) |
Video
Video
